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Heat Gun Motherboard Disconnection Processing Method
Jul 24, 2018

Most of the heat gun motherboard disconnection and drop points are caused by improper operation. Especially, the rubberized CPU is the easiest to operate improperly, causing the motherboard to be disconnected and dropped. The temperature of the heat gun is adjusted to 5.5. The air volume of the heat gun is adjusted to 6.5-7. The actual temperature is 270 degrees - 280 degrees. The CPU is blown up. Everyone knows that the sealing glue of the CPU is generally soft after being heated. There is a lot of other motherboards on the motherboard. There are no broken wires and dropped points. This is because you did not heat the CPU evenly when using the air gun!


Go or solder the plastic cable or sit on the keyboard and some of the ringing bells and go to the same power amplifier to master the heat and air volume of the heat gun! You can't try it yourself!

Blow soldering

Why is there a short circuit when the CPU is often short-circuited with a new CPU or other BGA IC? When blowing a CPU or other BGA IC, the IC address of the motherboard BGA is mainly cleaned. The same is true when applying the flux IC. The main thing to note is that the position of the IC on the motherboard must be accurate. When the position of the IC of the blow soldering CPU or other BGA is not allowed to blow the tin, the IC will automatically locate you. Misplaced, so pay attention to the position of the IC in the main board to use the heat gun air volume to be small at 270-280 degrees to have their own.

In the blow soldering IC, you should pay attention to whether the tin ball you make is large or small. The solder ball is blown. It is necessary to pay attention to the small range of IC activity. This makes it difficult for the solder balls under the IC to roll together to cause a short circuit. The IC's tin ball has a small range of activities.